• ATP Tube
  • Vias: Au or Cu Solid Filled
  • Microstrip Transmission Lines
  • Polyimide Supported Bridges
  • Solder Dams
Welcome To ATP

Applied Thin-Film Products (ATP) was founded in the heart of Silicon Valley specifically for the purpose of providing state-of-the-art thin-film circuit processing. ATP’s manufacturing facility and cleanrooms were designed and setup for thin-film circuit fabrication. ATP’s experienced personnel and representatives possess motivation and integrity which is reflected by the reputation we enjoy in the Wireless RF and Microwave field. ATP takes great pride in delivering superior processing and products with punctual delivery and competitive pricing.

Thin-Film Fabrication

Complete In-House Thin-Film Circuit Fabrication Service

Pattern Generated Photomasks

In-House Resistor Laser Trimming and CO2 Laser Drilling

Multiple Sputtering Systems and Plating Capabilities

Air Bridges/Crossovers with Polyimide and Solder Dams

Wide Selection of Materials and Metallizations

Hollow Plated and Solid Filled Via Capabilities

AI203, AIN, BeO, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics

Multiple Part Number Array (Pizza Array) Capability

Quick Turn Engineering Prototypes

Predeposited Gold/Tin (Au/Sn)

High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534

AS9100 Certified and ISO 9001:2008 Certified

ITAR Registered as a defense contractor with the United States Department of State, Office of Defense Trade Controls and Compliance

ATP complies with the U.S. Dodd-Frank Wall Street Reform and Consumer Protection Act concerning “conflict minerals” originating from the Democratic Republic of the Congo (DRC) or adjoining countries. A copy of the current CFSI Declaration can be supplied to customers upon request.


ATP is seeking manufacturer representation in Canada

Interested parties should contact us at atp@thinfilm.com

New... Engineering Transmission Lines Kits!

ATP is pleased to offer new Microstrip Transmission Lines Engineering Kits to help your bread-boarding needs with a cost effective solution. More...

New... Chip Trays!

ATP has an extensive inventory of industry standard chip trays (waffle packs) to meet your packaging needs. More...


ATP is celebrating 20 years of value added services, so please visit us at the following upcoming shows for exciting new products and services.

2016 SPIE Photonics West Show

February 16–18, 2016

San Francisco, CA, USA

Come see us at booth #4348


OFC Conference

March 22–24, 2016

Anaheim Convention Center
Anaheim, CA, USA

Visit us at booth #3533



May 24–26, 2016

Moscone Center
San Francisco, CA, USA

Visit us at booth #2339


European Microwave

October 4–6, 2016

ExCel London Exhibition & Convention Centre
London, UK

Visit us at booth #212


Company Technologies Capabilities Design Guidelines Products Other


Polyimide Supported Bridges


Standard Dimensions and Tolerances

Inductor Coils


Quality Assurance System

Solder Dams


Material and Conversion Tables

Microstrip Transmission Lines

Contact Us


Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Eng. Transmission Lines Kits

Terms of Use


Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

Stand Off/Isolation Pads

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Backside Burnishing Treatment

Safe Current Limits

ATP Bond Qualification Coupons


Contact Us

Edge Wraps


Design Rules Documents

Product Samples


Gold Bumping

Integrated TaN Resistors


Packaging/Chip Trays


Fractal Fasten

Laser Resistor Trimming