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Welcome To ATP

Applied Thin-Film Products (ATP) was founded in the heart of Silicon Valley specifically for the purpose of providing state-of-the-art thin-film circuit processing. ATP’s manufacturing facility and cleanrooms were designed and setup for thin-film circuit fabrication. ATP’s experienced personnel and representatives possess motivation and integrity which is reflected by the reputation we enjoy in the Wireless RF and Microwave field. ATP takes great pride in delivering superior processing and products with punctual delivery and competitive pricing.

 
Thin-Film Fabrication Technology

Complete In-House Thin-Film Circuit Fabrication Service

Pattern Generated Photomasks

In-House Resistor Laser Trimming and CO2 Laser Drilling

Multiple Sputtering Systems and Plating Capabilities

Air Bridges/Crossovers with Polyimide and Solder Dams

Wide Selection of Materials and Metallizations

Hollow Plated and Solid Filled Via Capabilities

AI203, AIN, BeO, Fused Silica/Quartz and Hi-K Dielectrics

Multiple Part Number Array (Pizza Array) Capability

Quick Turn Engineering Prototypes

Predeposited Gold/Tin (Au/Sn)

High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534

AS9100 Certified and ISO 9001:2008 Certified

 
News and Events

International Microwave Symposium

IEEE-MTTS

June 4–6, 2013

Seattle, Washington, USA

ATP Booth #2221

http://www.ims2013.org

Applied Thin-Film Products (ATP) conforms to the requirements of the European Union’s Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) Directive, 2011/65/EU.

Applied Thin-Film Products (ATP) supports the Dodd-Frank Wall Street Reform and Consumer Protection Act and has worked with our supply chain to comply with Section 1502 of this legislation. More >

ATP has documented information on file from its current raw material supply chain concerning the origin of metals, minerals, and raw materials referenced in Section 1502. This documentation verifies that these raw materials do not originate from the Democratic republic of the Congo (the “Conflict Region”) or its adjoining countries.

Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Supported Bridges

Photomasks

Standard Dimensions and Tolerances

Inductor Coils

Home

Quality Assurance System

Solder Dams

Substrates

Material and Conversion Tables

Microstrip Transmission Lines

Contact Us

Directions

Laser Diode Submounts

Material Specs

Thermal Performance

Stand Off/Isolation Pads

Terms of Use

Employment

Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

ATP Bond Qualification Coupons

Privacy Policy

Sales Rep’s

Vias: Au/Cu Solid Filled

Metallizations

Safe Current Limits

Product Samples

Facebook

Contact Us

Edge Defined Wraps

Integrated TaN Resistors

Design Rules Documents

   
 

Gold Bumping

Laser Resistor Trimming

     
 

Fractal Fasten

Serialization