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Welcome To ATP

Applied Thin-Film Products (ATP) was founded in the heart of Silicon Valley specifically for the purpose of providing state-of-the-art thin-film circuit processing. ATP’s manufacturing facility and cleanrooms were designed and setup for thin-film circuit fabrication. ATP’s experienced personnel and representatives possess motivation and integrity which is reflected by the reputation we enjoy in the Wireless RF and Microwave field. ATP takes great pride in delivering superior processing and products with punctual delivery and competitive pricing.

 
Thin-Film Fabrication Technology

Complete In-House Thin-Film Circuit Fabrication Service

Pattern Generated Photomasks

In-House Resistor Laser Trimming and CO2 Laser Drilling

Multiple Sputtering Systems and Plating Capabilities

Air Bridges/Crossovers with Polyimide and Solder Dams

Wide Selection of Materials and Metallizations

Hollow Plated and Solid Filled Via Capabilities

AI203, AIN, BeO, Fused Silica/Quartz and Hi-K Dielectrics

Multiple Part Number Array (Pizza Array) Capability

Quick Turn Engineering Prototypes

Predeposited Gold/Tin (Au/Sn)

High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534

AS9100 Certified and ISO 9001:2008 Certified

ITAR Registered as a defense contractor with the United States Department of State, Office of Defense Trade Controls and Compliance

 
News and Events

SPIE Photonics West 2015

February 10–12, 2015

San Francisco, California USA

Booth # 4326

http://spie.org/x2584.xml

OFC (Optical Fiber Conference) 2015

March 24–26, 2015

Los Angeles, California USA

Booth # 2340

http://www.ofcconference.org

IEEE/MTT-S/IMS 2015

May 19–21, 2015

Phoenix, Arizona USA

Booth # 3222

http://www.ims2015.org

New... Chip Trays!

ATP has an extensive inventory of industry standard chip trays (waffle packs) to meet your packaging needs. More...

Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Supported Bridges

Photomasks

Standard Dimensions and Tolerances

Inductor Coils

Home

Quality Assurance System

Solder Dams

Substrates

Material and Conversion Tables

Microstrip Transmission Lines

Contact Us

Directions

Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Stand Off/Isolation Pads

Terms of Use

Employment

Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

ATP Bond Qualification Coupons

Privacy Policy

Sales Rep’s

Vias: Au/Cu Solid Filled

Metallizations

Safe Current Limits

Product Samples

Facebook

Contact Us

Edge Defined Wraps

Integrated TaN Resistors

Design Rules Documents

Packaging/Chip Trays

 
 

Gold Bumping

Laser Resistor Trimming

     
 

Fractal Fasten

Serialization