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Minimum line-width:
Typical 0.0004" (10.16µm)
Smaller dimensions may be available.
Please contact our Sales Department for details.
Minimum Gap:
Typical 0.0004" (10.16µm)
Smaller dimensions may be available.
Please contact our Sales Department for details.
Resistor Minimum Length and Width:
Typical 0.002" (0.0508mm)
Smaller dimensions may be available.
Please contact our Sales Department for details.
Dimensional tolerance on critical areas:
Typical ± 0.0001" (2.54µm)
Select: ± 0 .00005" (1.25µm)
Dimensional tolerance on non-critical areas: Typical ± 0.0002" (5.08µm)
Circuit Dimensional tolerance—Diamond Sawn:
Typical ± 0.002" (50.8µm)
Select: ± 0.0005" ± (12.5µm)
Resistor tolerance (passivation only):
Typical: ± 10%
Select: ± 5% (subject to quantity and value restrictions)
Resistor tolerance (with laser trim):
Typical: ± 2%
Select: ± 0.5%
Via to pattern registration:
Typical: ± 0.002" (0.0508mm)
Select: ± 0.001" (0.0254mm)
Smaller dimensions may be available.
Please contact our Sales Department for details.
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Via hole diameter tolerance:
Typical: ± 0.002" (0.0508mm)
Select: ± 0.001" (0.0254mm)
Via hole diameter aspect ratio:
Typical: > 0.85
Select: > 0.50
Aspect ratio is defined as: Dv / Ts where:
Dv = Diameter of the via (thru hole)
Ts = Thickness of the substrate
Via hole taper:
Typical: 10%
Select: 0.001" (0.0254mm)
Via hole location tolerance:
Typical: ± 0.002" (0.0508mm)
Select: ± 0.001" (0.0254mm)
Via hole spacing:
One diameter min distance
Laser Machined features:
Typical: ± 0.002" (0.0508mm)
Select: ± 0.001" (0.0254mm)
Laser Machined Radius:
Typical: 0.006" (0.152mm)
Select: 0.003" (0.0762mm)
Larger view
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