Laser Drilling

Our computer-controlled CO2 lasers can create features of virtually any planar shape and can deliver positional accuracies of 0.001" (0.0254mm) or better over areas as large as 8"x8" (152.4mm x 152.4mm). The laser is extremely flexible and permits close location of features with considerable layout flexibility.

Types of Ceramic Materials

Materials covered include Alumina, Beryllium Oxide, Aluminum Nitride, Ferrite and Fused Silica/Quartz.

Machined Features

Virtually any planar shape can be cut in ceramic substrates. These shapes include circles, curves, rectangles, polygons, rounded thin slots, etc. Since ceramics are strong but brittle, the designer should consider a radius as large as practical on the inside corners. All inside corners will need to have a minimum of 0.003" (0.0762mm) radius due to the laser beam diameter. Rounding inside corners can reduce chipping and cracking.

Annealing

High temperature annealing for alumina based substrates is also offered. This can increase ceramic flexural strength, improve adhesion, and reduce internal stresses.

Handling and Cleaning

Laser protective coating is applied to protect material surface finishes and parts during the laser process. Laser protective coating also guards against adhesion of “slag” to material surfaces. Slag buildup is primarily found on the beam exit side of the substrate and is removed after laser processing.

Tolerances for Drilling

The tolerances provided below will generally produce the most cost effective laser processing. Tighter tolerances can be achieved at in increase in cost and lead-time. Spacing between via holes should be a minimum of one via diameter.

Other taper and diameter tolerances available upon request. Please contact our sales department for more information.