Introduction

Our goal at Applied Thin-Film Products (ATP) is to constantly evolve our processing and material capabilities to reflect our customers changing needs. Since 1995 our state-of-the-art thin-film facility was founded in the heart of Silicon Valley specifically for this purpose. ATP’s experienced personnel and representatives possess motivation and integrity which is reflected by the reputation we enjoy in the military, wireless, and fiber optic marketplace.

In order to address a growing global market, ATP has opened a manufacturing facility in Shanghai, China. This additional location greatly enhances our communication with and support of the manufacturing and assembly operations in the Pacific Rim. We also utilize ATP Shanghai for large volume domestic projects (where delivery time allows).

ATP offers build-to-print service for a wide range of materials and metalization schemes. ATP fabricates circuits on substrates from As-Fired Alumina, Polished Alumina, Aluminum Nitride, Beryllium Oxide, Fused Silica, Sapphire, Ferrites, Garnets, and Hi-K Dielectrics.

Metalizations range from the standard TaN/TiW/Au to films including Nickel, Titanium, Chrome, Palladium, and Platinum.

Circuit features can include fine pitch conductors, integrated resistors, vias, wrap-arounds, double sided patterning, and polyimide supported bridges.