Plated Through or Solid Filled Vias

ATP offers embedded ground connections formed with via holes through the substrate material. These connections provide a convenient means of obtaining a ground return through the case of the mounting medium without the use of cumbersome bond ribbons. Assembly concerns are also addressed by eliminating epoxy and solder bleed onto the component mounting surfaces with either polyimide or solid filled vias.

Hollow Plated Vias

Hollow plated vias are Laser or Ultrasonic drilled with diameters as low as 50% of the material thickness and are avalable on alumina (AL2O3) aluminum nitride (AlN), berryllium oxide (BEO), and Fused Silica /Quartz. This process can be used to create slots and castellations.

Hollow Plated Vias

Enforced Hollow Plated Via-wrap

Enforced vias are an additive process to the Standard hollow plated vias. This application is used for additional conductive material in the via holes. This process will insure increased stability and conductivity. Metal overlaps over existing standard metalizations. The metal via wrap on the surface can be a minimum of 0.002" (0.0508mm) larger than the via hole diameter. The Au metal via wrap thickness can be 100–400µ" (2.5–10 microns).

Enforced Hollow Plated Via-wrap

Polyimide Filled Vias

Via is filled with a non-conductive polyimide plug for via hole assemblies. The non-conductive plug will prevent epoxy and eutectic solders from reaching the surface of the circuit, while keeping continuity between the back side and front side surfaces.

Polyimide Filled Vias

Hollow Plated, Polyimide Filled, and Enforced Via Sizes

Substrate Thickness	Preferred Hole Diameter	Allowable Hole Diameter
0.005" (0.127mm)	0.004–0.005" (0.101–0.127mm)	ø.003–0.005" (0.076–0.127mm)
0.010" (0.254mm)	0.008–0.010" (0.202–0.254mm)	ø.006–0.010" (0.152–-0.254mm)
0.015" (0.381mm)	0.012–0.015" (0.305–0.381mm)	ø.008–0.015" (0.203–0.381mm)
0.020" (0.508mm)	0.015–0.020" (0.381–0.508mm)	ø.010–0.020" (0.254–0.508mm)
0.025" (0.635mm)	0.020–0.025" (0.508–0.635mm)	ø.012–0.025" (0.203–0.635mm)

Au Solid Filled Vias

The Au Via is completly filled and polished to provide a planarized surface providing a low inductance ground path. Filled vias can also act as a thermal via or two-sided signal interconnect. ATP offers three types of solid filled via circuits. Filled vias are avalable on alumina (AL2O3), aluminum nitride (AlN), and berryllium oxide (BEO). Planarity is typically < 0.001" (0.0254mm).

Au Solid Filled Vias

Au Solid Filled Via sizes

Substrate Thickness	Filled Via Diameter	Via Spacing Center to Center
0.005" (0.127mm)	ø.004–0.005" (0.101-0.127mm)	0.012" (0.305mm)
0.010" (0.254mm)	ø.008–0.010" (0.202-0.254mm)	0.025" (0.635mm)
0.015" (0.381mm)	ø.008–0.012" (0.202-0.305mm)	0.027" (0.685mm)
0.020" (0.508mm)	ø.008–0.012" (0.202-0.305mm)	0.029" (0.736mm)
0.025" (0.635mm)	ø.010–0.012" (0.254-0.305mm)	0.031" (0.787mm)